Probing the interfacial adhesion strength in compositional libraries of epoxy films

Christopher M. Stafford, Jae Hyun Kim, Daisuke Kawaguchi, Gareth Royston, Martin Y.M. Chiang

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

4 被引用数 (Scopus)

抄録

We are developing a measurement platform, based on the edge delamination test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial adhesion and reliability of epoxy films bonded to a rigid substrate. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for creating discrete and continuous gradients in composition of viscous epoxy formulations. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.

本文言語英語
ホスト出版物のタイトルMaterials Research Society Symposium Proceedings
ページ129-137
ページ数9
出版ステータス出版済み - 6 30 2006
外部発表はい
イベントCombinatorial Methods and Informatics in Materials Science - Boston, MA, 米国
継続期間: 11 28 200512 1 2005

出版物シリーズ

名前Materials Research Society Symposium Proceedings
894
ISSN(印刷版)0272-9172

その他

その他Combinatorial Methods and Informatics in Materials Science
国/地域米国
CityBoston, MA
Period11/28/0512/1/05

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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