Progress and perspective of optical MEMS packaging technology

Renshi Sawada, Hirofumi Nogami, Eiji Higurashi

研究成果: Contribution to journal › Article › 査読

本文言語	英語
ページ（範囲）	558-566
ページ数	9
ジャーナル	Journal of Japan Institute of Electronics Packaging
巻	21
号	6
DOI	https://doi.org/10.5104/jiep.21.558
出版ステータス	出版済み - 9 2018

All Science Journal Classification (ASJC) codes

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title = "Progress and perspective of optical MEMS packaging technology",

author = "Renshi Sawada and Hirofumi Nogami and Eiji Higurashi",

year = "2018",

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journal = "Journal of Japan Institute of Electronics Packaging",

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