Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet

Masashi Kitamura, Syuhei Kurokawa, Yuta Tokumoto, Terutake Hayashi, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh

研究成果: 著書/レポートタイプへの貢献会議での発言

1 引用 (Scopus)

抜粋

This study is associated with pad conditioning using a high-pressure jet. The high-pressure jet is expected as a non- destructive conditioning method to achieve excellent pad cleaning and the long pad life. However, it is necessary to indicate the extent of the effect quantitatively in order to demonstrate the effect of conditioning. In this study, the authors proposed a method to evaluate pad cleanliness quantitatively by counting pores and debris on the pad surface. Cleanliness is one of the parameters representing the surface properties of the pad. Furthermore, the authors investigated the effect of cleaning by the high-pressure jet in accordance with the proposed method. As a result, it was possible to distinguish the difference of the cleaning effect quantitatively according to the difference of cleaning condition parameters. The results of this study can be applied to the evaluation of pad conditioning effect, and are useful for such as optimization of pad conditioning.

元の言語英語
ホスト出版物のタイトル2015 International Conference on Planarization/CMP Technology, ICPT 2015
出版者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781619565104
出版物ステータス出版済み - 2 17 2016
イベントInternational Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, 米国
継続期間: 9 30 201510 2 2015

出版物シリーズ

名前2015 International Conference on Planarization/CMP Technology, ICPT 2015

その他

その他International Conference on Planarization/CMP Technology, ICPT 2015
米国
Chandler
期間9/30/1510/2/15

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

これを引用

Kitamura, M., Kurokawa, S., Tokumoto, Y., Hayashi, T., Hiyama, H., Wada, Y., & Takatoh, C. (2016). Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. : 2015 International Conference on Planarization/CMP Technology, ICPT 2015 [7411952] (2015 International Conference on Planarization/CMP Technology, ICPT 2015). Institute of Electrical and Electronics Engineers Inc..