Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces

M. A.A. Mohd Salleh, S. D. McDonald, H. Yasuda, A. Sugiyama, K. Nogita

研究成果: Contribution to journalArticle査読

48 被引用数 (Scopus)

抄録

In situ observations of the reaction between solid Cu in contact with molten Sn-0.7 wt.% Cu were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting, the rapid dissolution of Cu adjacent to the solid-liquid interface was followed by near-instantaneous interfacial intermetallic compound (IMC) formation. The kinetics of IMC formation were also elucidated. The results provide direct experimental evidence of the sequence of events in the dissolution reaction and subsequent diffusion, and in particular of the growth mechanisms of the IMC layer.

本文言語英語
ページ(範囲)17-20
ページ数4
ジャーナルScripta Materialia
100
DOI
出版ステータス出版済み - 4 15 2015
外部発表はい

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学
  • 金属および合金

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