Real time synchrotron x-ray imaging for nucleation and growth of cu6sn5 in sn-7cu-0.05ni high temperature lead-free solder alloys

Kazuhiro Nogita, Hideyuki Yasuda, Stuart D. Mcdonald, And Kentaro Uesugi

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

6 被引用数 (Scopus)

抄録

This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu6Sn5 in a eutectic Sn-Cu6Sn5 matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu6Sn5. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.

本文言語英語
ホスト出版物のタイトルAdvanced Materials Engineering and Technology
ページ200-204
ページ数5
DOI
出版ステータス出版済み - 2013
イベント2012 International Conference on Advanced Materials Engineering and Technology, ICAMET 2012 - Penang, マレーシア
継続期間: 11 28 201211 30 2012

出版物シリーズ

名前Advanced Materials Research
626
ISSN(印刷版)1022-6680

その他

その他2012 International Conference on Advanced Materials Engineering and Technology, ICAMET 2012
国/地域マレーシア
CityPenang
Period11/28/1211/30/12

All Science Journal Classification (ASJC) codes

  • 工学(全般)

フィンガープリント

「Real time synchrotron x-ray imaging for nucleation and growth of cu<sub>6</sub>sn<sub>5</sub> in sn-7cu-0.05ni high temperature lead-free solder alloys」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル