Reliability analysis of adhesive for PBT-epoxy interface

Kazuo Kato, Takashi Aoki, Yasushi Okamoto, Keiji Tanaka, Atsushi Takahara

研究成果: 会議への寄与タイプ論文

抄録

PBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed. Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing.

元の言語英語
出版物ステータス出版済み - 12 1 2007
イベント2007 World Congress - Detroit, MI, 米国
継続期間: 4 16 20074 19 2007

その他

その他2007 World Congress
米国
Detroit, MI
期間4/16/074/19/07

Fingerprint

Reliability analysis
Functional groups
Adhesives
Adhesion
Annealing
Degradation
Dimensional stability
Reforming reactions
Heat resistance
Molding
Boundary layers
Temperature

All Science Journal Classification (ASJC) codes

  • Automotive Engineering
  • Safety, Risk, Reliability and Quality
  • Pollution
  • Industrial and Manufacturing Engineering

これを引用

Kato, K., Aoki, T., Okamoto, Y., Tanaka, K., & Takahara, A. (2007). Reliability analysis of adhesive for PBT-epoxy interface. 論文発表場所 2007 World Congress, Detroit, MI, 米国.

Reliability analysis of adhesive for PBT-epoxy interface. / Kato, Kazuo; Aoki, Takashi; Okamoto, Yasushi; Tanaka, Keiji; Takahara, Atsushi.

2007. 論文発表場所 2007 World Congress, Detroit, MI, 米国.

研究成果: 会議への寄与タイプ論文

Kato, K, Aoki, T, Okamoto, Y, Tanaka, K & Takahara, A 2007, 'Reliability analysis of adhesive for PBT-epoxy interface' 論文発表場所 2007 World Congress, Detroit, MI, 米国, 4/16/07 - 4/19/07, .
Kato K, Aoki T, Okamoto Y, Tanaka K, Takahara A. Reliability analysis of adhesive for PBT-epoxy interface. 2007. 論文発表場所 2007 World Congress, Detroit, MI, 米国.
Kato, Kazuo ; Aoki, Takashi ; Okamoto, Yasushi ; Tanaka, Keiji ; Takahara, Atsushi. / Reliability analysis of adhesive for PBT-epoxy interface. 論文発表場所 2007 World Congress, Detroit, MI, 米国.
@conference{a5ca98557b2d41eaa477e21581e39ae8,
title = "Reliability analysis of adhesive for PBT-epoxy interface",
abstract = "PBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed. Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing.",
author = "Kazuo Kato and Takashi Aoki and Yasushi Okamoto and Keiji Tanaka and Atsushi Takahara",
year = "2007",
month = "12",
day = "1",
language = "English",
note = "2007 World Congress ; Conference date: 16-04-2007 Through 19-04-2007",

}

TY - CONF

T1 - Reliability analysis of adhesive for PBT-epoxy interface

AU - Kato, Kazuo

AU - Aoki, Takashi

AU - Okamoto, Yasushi

AU - Tanaka, Keiji

AU - Takahara, Atsushi

PY - 2007/12/1

Y1 - 2007/12/1

N2 - PBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed. Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing.

AB - PBT (polybutylene terephthalate) and epoxy adhesive, which both have superior heat resistance and environmental resistance, are a representative combination now being applied to many parts. Generally, PBT is annealed after molding at a temperature above the glass transition temperature to ensure dimensional stability when in use. But in this case, this process decreases the adhesive strength between PBT and epoxy. This study analyzes the adhesion degradation mechanism in this system and a countermeasure technology is proposed. Regarding this PBT-epoxy adhesion degradation mechanism, focus is placed on changes in the fracture surface, which is analyzed before and after annealing. From this analysis it becomes clear that generation of a WBL (weak boundary layer) is caused by non-crystallization and a migration of the PBT functional group on the adhesion surface layer. According to this mechanism, it is clear that control of the functional group on the surface layer and reforming of a new functional group are very effective ways to maintain adhesive strength after annealing.

UR - http://www.scopus.com/inward/record.url?scp=84877409276&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84877409276&partnerID=8YFLogxK

M3 - Paper

ER -