Reliability and degradation behavior of a InGaAsP/InP waveguide photodiode for subscriber systems

Engineering

• Pn Junction 100%
• Absorption Layer 100%
• Surfaces 50%
• Thickness 50%
• Diffusion 50%
• Reliability 50%
• Plasma Enhanced Chemical Vapor Deposition 50%
• Reliability Analysis 50%
• Responsivity 50%

Physics

• Behavior 50%
• Area 50%
• Light 50%
• Diffusivity 50%
• Cleavage 50%
• Impurities 50%
• Reliability 50%
• Degradation 50%
• Flat Surfaces 50%