Room-temperature cu microjoining with ultrasonic bonding of cone-shaped bump

Lijing Qiu, Akihiro Ikeda, Kazuhiro Noda, Seiya Nakai, Tanemasa Asano

研究成果: ジャーナルへの寄稿学術誌査読

31 被引用数 (Scopus)

抄録

Room-temperature Cu-Cu bonding was realized by applying ultrasonic vibration together with compression force to the bonding of a cone-shaped bump. The size of the bump was about 10 μm. The connection pitch was 20 m. Mechanical characterization showed that the bonding strength increases with vibration amplitude and depends on the thickness of the counter electrode made of Cu. The thickness dependence of the bonding strength was found to be caused by an increase in the surface roughness of the counter electrode. It was shown that the bonding strength meets the requirement from application to products. Electrical characterization using a daisy-chain connection test demonstrated that more than 10,000 pins on a chip can be connected with a sufficiently low resistance.

本文言語英語
論文番号04CB10
ジャーナルJapanese journal of applied physics
52
4 PART 2
DOI
出版ステータス出版済み - 4月 2013

!!!All Science Journal Classification (ASJC) codes

  • 工学(全般)
  • 物理学および天文学(全般)

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