Room-temperature gold-gold bonding method based on argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optoelectronic device integration

Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato, Tadatomo Suga, Renshi Sawada

    研究成果: ジャーナルへの寄稿学術誌査読

    18 被引用数 (Scopus)

    抄録

    Low-temperature bonding methods of optoelectronic chips, such as laser diodes (LD) and photodiode (PD) chips, have been the focus of much interest to develop highly functional and compact optoelectronic devices, such as microsensors and communication modules. In this paper, room-temperature bonding of the optoelectronic chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3 nm) using argon and hydrogen gas mixture atmospheric-pressure plasma was demonstrated in ambient air. The die-shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (x2). The measured results of the light-current-voltage characteristics of the LD chips and the dark current-voltage characteristics of the PD chips indicated no degradation after bonding.

    本文言語英語
    ページ(範囲)339-345
    ページ数7
    ジャーナルIEICE Transactions on Electronics
    E99C
    3
    DOI
    出版ステータス出版済み - 3月 2016

    !!!All Science Journal Classification (ASJC) codes

    • 電子材料、光学材料、および磁性材料
    • 電子工学および電気工学

    フィンガープリント

    「Room-temperature gold-gold bonding method based on argon and hydrogen gas mixture atmospheric-pressure plasma treatment for optoelectronic device integration」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

    引用スタイル