Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim

Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano

研究成果: ジャーナルへの寄稿記事

1 引用 (Scopus)

抄録

In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.

元の言語英語
ページ(範囲)2897-2903
ページ数7
ジャーナルSensors and Materials
30
発行部数12
DOI
出版物ステータス出版済み - 1 1 2018

Fingerprint

rims
packaging
Packaging
ultrasonics
Ultrasonics
room temperature
vacuum tests
Vacuum
Microsystems
pressing
Temperature
Cones
cones
counters
vacuum
cavities
air
cross sections
Air
Hermetic

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Materials Science(all)

これを引用

Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim. / Takigawa, Ryo; Iwanabe, Keiichiro; Ikeda, Akihiro; Takao, Takayuki; Asano, Tanemasa.

:: Sensors and Materials, 巻 30, 番号 12, 01.01.2018, p. 2897-2903.

研究成果: ジャーナルへの寄稿記事

Takigawa, Ryo ; Iwanabe, Keiichiro ; Ikeda, Akihiro ; Takao, Takayuki ; Asano, Tanemasa. / Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim. :: Sensors and Materials. 2018 ; 巻 30, 番号 12. pp. 2897-2903.
@article{80408ae0e1634e5cbe365cf342d55a95,
title = "Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim",
abstract = "In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.",
author = "Ryo Takigawa and Keiichiro Iwanabe and Akihiro Ikeda and Takayuki Takao and Tanemasa Asano",
year = "2018",
month = "1",
day = "1",
doi = "10.18494/SAM.2018.1967",
language = "English",
volume = "30",
pages = "2897--2903",
journal = "Sensors and Materials",
issn = "0914-4935",
publisher = "M Y U Scientific Publishing Division",
number = "12",

}

TY - JOUR

T1 - Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim

AU - Takigawa, Ryo

AU - Iwanabe, Keiichiro

AU - Ikeda, Akihiro

AU - Takao, Takayuki

AU - Asano, Tanemasa

PY - 2018/1/1

Y1 - 2018/1/1

N2 - In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.

AB - In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.

UR - http://www.scopus.com/inward/record.url?scp=85059237071&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85059237071&partnerID=8YFLogxK

U2 - 10.18494/SAM.2018.1967

DO - 10.18494/SAM.2018.1967

M3 - Article

AN - SCOPUS:85059237071

VL - 30

SP - 2897

EP - 2903

JO - Sensors and Materials

JF - Sensors and Materials

SN - 0914-4935

IS - 12

ER -