Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim

Ryo Takigawa, Keiichiro Iwanabe, Akihiro Ikeda, Takayuki Takao, Tanemasa Asano

研究成果: Contribution to journalArticle

1 引用 (Scopus)

抜粋

In this paper, hermetic packaging using room-temperature (RT) Cu–Cu bonding is demonstrated for microsystem packaging. The bonding of the compliant rim made of Cu to electroplated Cu was performed with ultrasonic assist at RT. Owing to the cone-shaped cross section of the compliant rim, it easily deforms under pressing load with ultrasonic assist and bonds to the counter Cu film at RT. As a result of a simple vacuum test, the air leak rate of the cavity inside the bonded sample was approximately 2 × 10−11 Pa·m3/s, which may be sufficiently low for applications of vacuum packaging of microdevices.

元の言語英語
ページ(範囲)2897-2903
ページ数7
ジャーナルSensors and Materials
30
発行部数12
DOI
出版物ステータス出版済み - 2018

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Materials Science(all)

フィンガープリント Room-temperature hermetic packaging using ultrasonic cu–cu bonding with compliant rim' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用