Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

研究成果: ジャーナルへの寄稿学術誌査読

6 被引用数 (Scopus)

抄録

We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184mΩ/bump has been achieved at room temperature.

本文言語英語
論文番号04DB04
ジャーナルJapanese journal of applied physics
51
4 PART 2
DOI
出版ステータス出版済み - 4月 2012

!!!All Science Journal Classification (ASJC) codes

  • 工学(全般)
  • 物理学および天文学(全般)

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