Room temperature microjoining of qVGA class area-bump array using cone bump

Takanori Shuto, Keiichiro Iwanabe, Li Jing Qiu, Tanemasa Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

We show that room temperature microjoining a 332 x 268 array of bumps can be realized by using ultrasonic bonding of cone-shaped microbump. 20 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A flat planar electrode made of electoplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in ambient air. Electrical connection test shows all bump connections with low resistance have been achieved.

本文言語英語
ホスト出版物のタイトル2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
DOI
出版ステータス出版済み - 12 1 2012
イベント2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 - Kyoto, 日本
継続期間: 12 10 201212 12 2012

出版物シリーズ

名前2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012

その他

その他2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Country日本
CityKyoto
Period12/10/1212/12/12

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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