Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements

Keiichiro Iwanabe, Kenichi Nakadozono, Yosuke Senda, Tanemasa Asano

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that "softening" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.

本文言語英語
ホスト出版物のタイトル2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781467372688
DOI
出版ステータス出版済み - 2月 17 2016
イベント17th IEEE Electronics Packaging and Technology Conference, EPTC 2015 - Singapore, シンガポール
継続期間: 12月 2 201512月 4 2015

出版物シリーズ

名前Proceedings of the Electronic Packaging Technology Conference, EPTC
2016-February

その他

その他17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
国/地域シンガポール
CitySingapore
Period12/2/1512/4/15

!!!All Science Journal Classification (ASJC) codes

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学

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