TY - GEN
T1 - Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements
AU - Iwanabe, Keiichiro
AU - Nakadozono, Kenichi
AU - Senda, Yosuke
AU - Asano, Tanemasa
PY - 2016/2/17
Y1 - 2016/2/17
N2 - Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that "softening" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.
AB - Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that "softening" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.
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U2 - 10.1109/EPTC.2015.7412363
DO - 10.1109/EPTC.2015.7412363
M3 - Conference contribution
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
Y2 - 2 December 2015 through 4 December 2015
ER -