Secondary ion mass spectroscopic analysis of copper migration at the copper/polyimide interface

Norihiko Miki, Keiji Tanaka, Atsushi Takahara, Tisato Kajiyama

研究成果: ジャーナルへの寄稿記事

6 引用 (Scopus)

抜粋

The application of secondary ion mass spectroscopy (SIMS) for the interfacial analysis of copper migration at Cu/polyimide bilayer. The polyamic acid was coated on the Cu substrate and the bilayer was then cured. Copper was found to deeply migrate into the polyimide across its interface. However, the migration phenomena was not detected during vapor deposition of Cu onto the plastic film. Thus, preparation of the bilayer strongly affects Cu migration behavior.

元の言語英語
ページ(範囲)313-316
ページ数4
ジャーナルJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
18
発行部数1
DOI
出版物ステータス出版済み - 1 1 2000

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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