Silicon wafer cleaning using new liquid aerosol with controlled droplet velocity and size by rotary atomizer method

Yoshiyuki Seike, Keiji Miyachi, Tatsuo Shibata, Yoshinori Kobayashi, Syuhei Kurokawa, Toshiro Doi

研究成果: Contribution to journalArticle査読

12 被引用数 (Scopus)

抄録

A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.

本文言語英語
ページ(範囲)667011-667016
ページ数6
ジャーナルJapanese journal of applied physics
49
6 PART 1
DOI
出版ステータス出版済み - 6 1 2010

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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