Sn-Cu alloy electrodeposition and its connecting reliability for automotive connectors

Hiroaki Nakano, Satoshi Oue, Daisuke Yoshihara, Hisaaki Fukushima, Yoshifumi Saka, Shigeru Sawada, Yasuhiro Hattori

研究成果: ジャーナルへの寄稿記事

2 引用 (Scopus)

抄録

The electrodeposition behavior of Sn-Cu alloys in a sulfate solution containing three additives, cresol sulfonic acid, benzal acetone, and nonionic alkyl polyethylene glycol ether surfactant, was investigated potentiostatically between +0.3 and-0.7 V vs. NHE at 298 K. The contact resistance of the alloys deposited on a Cu connector was evaluated. Cu in the alloys behaved as a more noble metal than did Sn, thus showing the typical feature of regular-type codeposition. In solutions containing additives, the difference in deposition potential between Cu and Sn decreased because Cu deposition was significantly suppressed by the additives. The alloys deposited in solutions containing additives exhibited smooth surfaces and were composed of Cu, Sn, Cu 6Sn5, and Cu3 Sn phases in accordance with the equilibrium phase diagram of a binary Cu-Sn system. The contact resistance of the alloys increased by heating at 433 K, thus indicating that connecting reliability did not improve by plating with the stable metallic compound Cu 6Sn5. The connecting reliability of a connector after abrasion was higher in deposited alloy films than in Sn reflow plating.

元の言語英語
ページ(範囲)1237-1243
ページ数7
ジャーナルMaterials Transactions
52
発行部数6
DOI
出版物ステータス出版済み - 6 1 2011

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connectors
Electrodeposition
electrodeposition
cresol
Contact resistance
contact resistance
plating
Plating
phase diagrams
Metallic compounds
cresols
Sulfonic Acids
abrasion
sulfonic acid
Precious metals
Acetone
noble metals
Abrasion
Surface-Active Agents
Ether

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Sn-Cu alloy electrodeposition and its connecting reliability for automotive connectors. / Nakano, Hiroaki; Oue, Satoshi; Yoshihara, Daisuke; Fukushima, Hisaaki; Saka, Yoshifumi; Sawada, Shigeru; Hattori, Yasuhiro.

:: Materials Transactions, 巻 52, 番号 6, 01.06.2011, p. 1237-1243.

研究成果: ジャーナルへの寄稿記事

Nakano, Hiroaki ; Oue, Satoshi ; Yoshihara, Daisuke ; Fukushima, Hisaaki ; Saka, Yoshifumi ; Sawada, Shigeru ; Hattori, Yasuhiro. / Sn-Cu alloy electrodeposition and its connecting reliability for automotive connectors. :: Materials Transactions. 2011 ; 巻 52, 番号 6. pp. 1237-1243.
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