Soot Bonding Process and its Application to Si Dielectric Isolation

Renshi Sawada, J. Watanabe, H. Nakada, K. Koyabu

研究成果: Contribution to journalArticle査読

9 被引用数 (Scopus)

抄録

A dielectric isolated substrate produced by bonding two silicon substrates with Si—B—O soot particles generated by a flame hydrolysis reaction is introduced. There are three steps in the production process: spraying Si—B—O soot on a flat or a grooved silicon substrate, positioning a support substrate, and sintering. The grooves can be filled and the two substrates bonded at the same time and without voids. Experimentally fabricated large scale integrated circuits have good performance characteristics, over the whole substrate. This method can produce a 6 in. diam or larger dielectric-isolated substrate, which cannot be created with the conventional polysilicon deposition method.

本文言語英語
ページ(範囲)184-189
ページ数6
ジャーナルJournal of the Electrochemical Society
138
1
DOI
出版ステータス出版済み - 1 1 1991
外部発表はい

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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