The thin film stabilities of ω-N-(3-(dimethylamino)propyl)propylamide-terminated polystyrene (PS-N) and its blends with conventional polystyrene (PS-H) supported on silicon wafers with a native oxide layer were examined. Whereas a 20-nm-thick film of PS-H with a number-average molecular weight of ∼50k decomposed at 423 K, a comparable PS-N film and blended films containing a PS-N fraction of >40 wt% were stable. Although the local conformation of chains at the substrate interface was not the same for PS with and without the functional end group, the glass transition temperature at the interface was identical for both PS-H and PS-N. The residual adsorbed layer on the substrate after washing the films with a good solvent was thicker for PS-N than for PS-H. This implies that end functionalization, rather than segmental dynamics, affects chain movement on a large scale.
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