Stabilizing lithium plating-stripping reaction between a lithium phosphorus oxynitride glass electrolyte and copper thin film by platinum insertion

Kengo Okita, Ken Ichi Ikeda, Hikaru Sano, Yasutoshi Iriyama, Hikari Sakaebe

研究成果: Contribution to journalArticle査読

27 被引用数 (Scopus)

抄録

Lithium (Li) plating-stripping reaction properties at the lithium phosphorus oxynitride glass electrolyte (LiPON)/copper thin film (Cu) interface is improved by the insertion of nano-thickness platinum (Pt) layer at the interface. The LiPON films are formed on mirror-polished lithium-ion conductive solid electrolyte sheets, and current collector thin films of Li, Cu-Pt multi layer, and Cu are formed on the LiPON films. The plating-stripping reactions at the LiPON/current collector films interface are carried out by galvanostatic and potential sweep measurements. Galvanostatic measurements reveal that Pt layer insertion reduces the overvoltage of the reaction and improves its coulomb efficiency. Also, cyclic voltammetry measurement suggests formation of Li-Pt alloys at higher voltages than 0 V (vs. Li/Li+) during the lithium plating process. Scanning electron microscopy observation clarifies that platinum insertion moderate non-uniform lithium plating reaction. Most probably, Li-Pt alloys increase the reaction sites, resulting in both the stabilization of current collector and the reduction of the overvoltage of the lithium plating-stripping reaction upon cycling. The results shown here will be useful in improving the anode reaction of the "Li-free" all-solid-state lithium batteries.

本文言語英語
ページ(範囲)2135-2142
ページ数8
ジャーナルJournal of Power Sources
196
4
DOI
出版ステータス出版済み - 2 15 2011
外部発表はい

All Science Journal Classification (ASJC) codes

  • 再生可能エネルギー、持続可能性、環境
  • エネルギー工学および電力技術
  • 物理化学および理論化学
  • 電子工学および電気工学

フィンガープリント

「Stabilizing lithium plating-stripping reaction between a lithium phosphorus oxynitride glass electrolyte and copper thin film by platinum insertion」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル