Stem analysis of atom location in (Cu, Au, Ni)6Sn5intermetallic compounds

Wen Hui Yang, Tomokazu Yamamoto, Kazuhiro Nogita, Syo Matsumura

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

Cu6Sn5 is an important intermetallic compound in soldering and electronic packaging. It is formed at the interface between molten solder and substrate during the soldering process, and the evolution of microstructure and properties also occurs in service. Previous studies revealed that Au and Ni are stabilization alloying elements for hexagonal η-Cu6Sn5intermetallic. For better understanding of stabilization mechanisms at atomic resolution level, in this work, we made an attempt atomic structure analysis on a stoichiometric (Cu, Au, Ni)6Sn5intermetallic prepared by direct alloying. High-angle annular dark-field (HAADF) imaging and atomic-resolution chemical mapping were taken by the aberration-corrected (Cs-corrected) scanning transmission electron microscopy (STEM). It is found that Au and Ni doped Cu6Sn5has hexagonal structure. The atom sites of Cu1 and Sn can be distinguished in atomic-resolution images after being observed from orientation [2 1 1 0], which is also confirmed by atomic-resolution chemical mapping analysis. Importantly, atomic-resolution about distribution of alloying Au atom was directly observed, and Au atoms occupy the Cu1 sites in η-Cu6Sn5.

本文言語英語
ホスト出版物のタイトルElectronic Packaging Interconnect Technology
編集者Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Muhammad Faheem Mohd Tahir, Liyana Jamaludin
出版社Trans Tech Publications Ltd
ページ95-100
ページ数6
ISBN(印刷版)9783035713244
DOI
出版ステータス出版済み - 2018
イベントElectronic Packaging Interconnect Technology Symposium, EPITS 2017 - Fukuoka, 日本
継続期間: 11月 1 201711月 2 2017

出版物シリーズ

名前Solid State Phenomena
273 SSP
ISSN(印刷版)1012-0394
ISSN(電子版)1662-9779

その他

その他Electronic Packaging Interconnect Technology Symposium, EPITS 2017
国/地域日本
CityFukuoka
Period11/1/1711/2/17

!!!All Science Journal Classification (ASJC) codes

  • 原子分子物理学および光学
  • 材料科学(全般)
  • 凝縮系物理学

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