Stress analysis of powder compacts with graded structures in sintering process

Kazunari Shinagawa, Yasushi Hirashima

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

6 引用 (Scopus)

抜粋

During sintering of metal/ceramic functionally grade materials, cracks are often formed on the surface on the top ceramic layer due to the internal stress produced by mismatch shrinkage and warpage. The ways to reduce the internal stress are examined by using the finite element method as well as the plate theory for sintering. Uniaxial pressing, which gives the counter moment against the warping, can decrease the bending stress but only in the middle of the surface. Thinning the top layer is found to be effective in reducing the tensile stress on the surface when the sintering properties of some layers are modified appropriately. The suppression of the surface cracking in the improved graded powder compacts is confirmed by experiment.

元の言語英語
ホスト出版物のタイトルFunctionally Graded Materials VIII, FGM2004 - Proceedings of the 8th International Symposium on Multifunctional and Functionally Graded Materials, (FGM2004)
ページ477-482
ページ数6
出版物ステータス出版済み - 12 1 2005
外部発表Yes
イベント8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004 - Leuven, ベルギー
継続期間: 7 11 20047 14 2004

出版物シリーズ

名前Materials Science Forum
492-493
ISSN(印刷物)0255-5476

その他

その他8th International Symposium on Multifunctional and Functionally Graded Materials, FGM2004
ベルギー
Leuven
期間7/11/047/14/04

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

フィンガープリント Stress analysis of powder compacts with graded structures in sintering process' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Shinagawa, K., & Hirashima, Y. (2005). Stress analysis of powder compacts with graded structures in sintering process. : Functionally Graded Materials VIII, FGM2004 - Proceedings of the 8th International Symposium on Multifunctional and Functionally Graded Materials, (FGM2004) (pp. 477-482). (Materials Science Forum; 巻数 492-493).