Stress concentration and surface roughness effect on strength of polycrystalline silicon structure

Shigeru Hamada, Shuichi Tani, Daisuke Katagiri, Masahiro Tsugai, Makio Horikawa, Hiroshi Otani

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

In order to clarify the stress concentration and surface roughness effect on strength of the polycrystalline silicon (poly-Si) structure, bending tests of poly-Si microcantilever beam specimen and surface roughness measurement is performed. The bending test results are analyzed by means of maximum stress at the notch root calculated by FEM models, and it is found that this approach cannot describe the test results. Therefore, modified approach is taken into account by use of two parameters that are the maximum stress and area where stress is larger than 50% of the maximum stress, which indicates stress extension around the position of maximum stress representatively. By this two parameters approach, the test results are explained quantitatively and a strength design chart for stress concentration area of the poly-Si structure is obtained. On the other hand, relationship between strength and surface roughness are confirmed and useful information for the process quality control are obtained.

本文言語英語
ホスト出版物のタイトルProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
ページ1929-1934
ページ数6
PART C
出版ステータス出版済み - 2006
外部発表はい
イベントASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, 米国
継続期間: 7 17 20057 22 2005

その他

その他ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country米国
CitySan Francisco, CA
Period7/17/057/22/05

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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