Study of femtosecond laser ablation effect on micro-processing for 4H-SiC substrate

Chengwu Wang, Syuhei Kurokawa, Julong Yuan, Li Fan, Huizong Lu, Zhe Wu, Weifeng Yao, Kehua Zhang, Yu Zhang, Toshiro Doi

研究成果: ジャーナルへの寄稿記事

1 引用 (Scopus)

抄録

4H-SiC substrate was ablated by linearly polarized femtosecond (fs) laser in three direct write methods at different parameters, such as repetition rate, scanning velocity and fluence, etc. Two processing modes, transverse scanning mode (TSM) and cross irradiation mode (CIM), were introduced. The surface morphologies were observed by scanning electron microscopy (SEM) for detailed investigation. It was found that the surface morphologies differed remarkably at different processing parameters. Firstly, the shapes of micro craters fabricated at different repetition rates and ablation time duration were respectively investigated. The shape of fs laser spot was demonstrated to play an important role for the generation of micro craters. Secondly, the effect of scanning velocity on the formation of nanoripples and micro grooves were investigated. It was found that the spatial ripples could be refabricated during repeated fs laser ablation; periodic ripples and micro grooves depended on fs laser scanning velocity. Agglomerative substance was fabricated especially at slow scanning velocity. Furthermore, rippled surfaces induced at different fluence were achieved and exhibited. Regular and uniform surfaces with periodic ripples were fabricated at the fluence of 0.31∼0.38 J/cm 2 . Finally, CMP was carried out to study the effect of fs laser ablation on polishing.

元の言語英語
ページ(範囲)187-198
ページ数12
ジャーナルInternational Journal of Automation Technology
12
発行部数2
DOI
出版物ステータス出版済み - 1 1 2018

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Laser ablation
Ultrashort pulses
Scanning
Substrates
Processing
Surface morphology
Ablation
Polishing
Irradiation
Scanning electron microscopy

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

これを引用

Study of femtosecond laser ablation effect on micro-processing for 4H-SiC substrate. / Wang, Chengwu; Kurokawa, Syuhei; Yuan, Julong; Fan, Li; Lu, Huizong; Wu, Zhe; Yao, Weifeng; Zhang, Kehua; Zhang, Yu; Doi, Toshiro.

:: International Journal of Automation Technology, 巻 12, 番号 2, 01.01.2018, p. 187-198.

研究成果: ジャーナルへの寄稿記事

Wang, Chengwu ; Kurokawa, Syuhei ; Yuan, Julong ; Fan, Li ; Lu, Huizong ; Wu, Zhe ; Yao, Weifeng ; Zhang, Kehua ; Zhang, Yu ; Doi, Toshiro. / Study of femtosecond laser ablation effect on micro-processing for 4H-SiC substrate. :: International Journal of Automation Technology. 2018 ; 巻 12, 番号 2. pp. 187-198.
@article{9f4917aa4dd4427785c597366d01650b,
title = "Study of femtosecond laser ablation effect on micro-processing for 4H-SiC substrate",
abstract = "4H-SiC substrate was ablated by linearly polarized femtosecond (fs) laser in three direct write methods at different parameters, such as repetition rate, scanning velocity and fluence, etc. Two processing modes, transverse scanning mode (TSM) and cross irradiation mode (CIM), were introduced. The surface morphologies were observed by scanning electron microscopy (SEM) for detailed investigation. It was found that the surface morphologies differed remarkably at different processing parameters. Firstly, the shapes of micro craters fabricated at different repetition rates and ablation time duration were respectively investigated. The shape of fs laser spot was demonstrated to play an important role for the generation of micro craters. Secondly, the effect of scanning velocity on the formation of nanoripples and micro grooves were investigated. It was found that the spatial ripples could be refabricated during repeated fs laser ablation; periodic ripples and micro grooves depended on fs laser scanning velocity. Agglomerative substance was fabricated especially at slow scanning velocity. Furthermore, rippled surfaces induced at different fluence were achieved and exhibited. Regular and uniform surfaces with periodic ripples were fabricated at the fluence of 0.31∼0.38 J/cm 2 . Finally, CMP was carried out to study the effect of fs laser ablation on polishing.",
author = "Chengwu Wang and Syuhei Kurokawa and Julong Yuan and Li Fan and Huizong Lu and Zhe Wu and Weifeng Yao and Kehua Zhang and Yu Zhang and Toshiro Doi",
year = "2018",
month = "1",
day = "1",
doi = "10.20965/ijat.2018.p0187",
language = "English",
volume = "12",
pages = "187--198",
journal = "International Journal of Automation Technology",
issn = "1881-7629",
publisher = "Fuji Technology Press",
number = "2",

}

TY - JOUR

T1 - Study of femtosecond laser ablation effect on micro-processing for 4H-SiC substrate

AU - Wang, Chengwu

AU - Kurokawa, Syuhei

AU - Yuan, Julong

AU - Fan, Li

AU - Lu, Huizong

AU - Wu, Zhe

AU - Yao, Weifeng

AU - Zhang, Kehua

AU - Zhang, Yu

AU - Doi, Toshiro

PY - 2018/1/1

Y1 - 2018/1/1

N2 - 4H-SiC substrate was ablated by linearly polarized femtosecond (fs) laser in three direct write methods at different parameters, such as repetition rate, scanning velocity and fluence, etc. Two processing modes, transverse scanning mode (TSM) and cross irradiation mode (CIM), were introduced. The surface morphologies were observed by scanning electron microscopy (SEM) for detailed investigation. It was found that the surface morphologies differed remarkably at different processing parameters. Firstly, the shapes of micro craters fabricated at different repetition rates and ablation time duration were respectively investigated. The shape of fs laser spot was demonstrated to play an important role for the generation of micro craters. Secondly, the effect of scanning velocity on the formation of nanoripples and micro grooves were investigated. It was found that the spatial ripples could be refabricated during repeated fs laser ablation; periodic ripples and micro grooves depended on fs laser scanning velocity. Agglomerative substance was fabricated especially at slow scanning velocity. Furthermore, rippled surfaces induced at different fluence were achieved and exhibited. Regular and uniform surfaces with periodic ripples were fabricated at the fluence of 0.31∼0.38 J/cm 2 . Finally, CMP was carried out to study the effect of fs laser ablation on polishing.

AB - 4H-SiC substrate was ablated by linearly polarized femtosecond (fs) laser in three direct write methods at different parameters, such as repetition rate, scanning velocity and fluence, etc. Two processing modes, transverse scanning mode (TSM) and cross irradiation mode (CIM), were introduced. The surface morphologies were observed by scanning electron microscopy (SEM) for detailed investigation. It was found that the surface morphologies differed remarkably at different processing parameters. Firstly, the shapes of micro craters fabricated at different repetition rates and ablation time duration were respectively investigated. The shape of fs laser spot was demonstrated to play an important role for the generation of micro craters. Secondly, the effect of scanning velocity on the formation of nanoripples and micro grooves were investigated. It was found that the spatial ripples could be refabricated during repeated fs laser ablation; periodic ripples and micro grooves depended on fs laser scanning velocity. Agglomerative substance was fabricated especially at slow scanning velocity. Furthermore, rippled surfaces induced at different fluence were achieved and exhibited. Regular and uniform surfaces with periodic ripples were fabricated at the fluence of 0.31∼0.38 J/cm 2 . Finally, CMP was carried out to study the effect of fs laser ablation on polishing.

UR - http://www.scopus.com/inward/record.url?scp=85049130083&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85049130083&partnerID=8YFLogxK

U2 - 10.20965/ijat.2018.p0187

DO - 10.20965/ijat.2018.p0187

M3 - Article

VL - 12

SP - 187

EP - 198

JO - International Journal of Automation Technology

JF - International Journal of Automation Technology

SN - 1881-7629

IS - 2

ER -