Study of Laser Ablation Slits in Stress Reduced Embedded Die Substrate Fabricated for Heterogeneous Integration

Masamitsu Matsuura, Tanemasa Asano, Haruichi Kanaya

研究成果: 書籍/レポート タイプへの寄稿会議への寄与

抄録

The residual stress of the silicon die in an embedded die substrate was investigated. A silicon test element chip having piezo-resistance gauges was embedded in a printed circuit board substrate with the newly developed hollow chamber and laser-drilled slits around die technology. The embedded die was mechanically held with a copper redistribution layer (RDL), and dielectric epoxy resin remained at a part of the periphery. Slits of various designs were fabricated. The residual stresses near the center and a corner of the chip and their change with temperature were measured. The laser slits enabled to reduce the residual stress due to the difference in coefficient of thermal expansion (CTE) between materials.

本文言語英語
ホスト出版物のタイトル2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ563-567
ページ数5
ISBN(電子版)9781665416191
DOI
出版ステータス出版済み - 2021
イベント23rd IEEE Electronics Packaging Technology Conference, EPTC 2021 - Virtual, Online, シンガポール
継続期間: 12月 1 202112月 30 2021

出版物シリーズ

名前2021 IEEE 23rd Electronics Packaging Technology Conference, EPTC 2021

会議

会議23rd IEEE Electronics Packaging Technology Conference, EPTC 2021
国/地域シンガポール
CityVirtual, Online
Period12/1/2112/30/21

!!!All Science Journal Classification (ASJC) codes

  • 電子工学および電気工学
  • 安全性、リスク、信頼性、品質管理
  • 電子材料、光学材料、および磁性材料
  • 流体および伝熱

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