Study on chemical interaction analysis of reactive fullerenol molecules in Cu-CMP using high-sensitive Raman spectroscopy

Ryota Murai, Yasuhiro Yakaya, Terutake Hayashi, Masaki Michihata

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

1 被引用数 (Scopus)

抄録

Surface with nanometer accuracy is required to manufacturing process of integrated circuit (IC) devices. One of the most promising techniques for surface planarization is chemical mechanical polishing (CMP). CMP is a high efficiency process, both due to the varied chemical and physical properties of the surface materials. Conventional CMP uses the slurry, which is composed of abrasive particles suspended in a chemical solution. The abrasive particle is effective for surface planarization by a chemical mechanism with little mechanical abrasion. So chemical reactivity appears to be an essential factor of CMP process. In our conventional study, fullerenols have been proposed as suitable abrasives for copper CMP. The chemical reactivity of fullerenol is suggested by the fact that high removal rate (150 nm/min) and surface flatness (0.6 nm RMS) have been confirmed using fullerenol slurry. In this study, we analyzed the chemical reactivity between fullerenol molecule and copper surface, which is important to understand the material removal mechanism. Using the intrinsic Raman spectroscopic signal of interaction between fullerenol and copper with surface plasmon resonance (SPR), the chemical reactivity over a period of the reaction process was analyzed. Raman spectroscopy is commonly used in chemical analysis, since vibrational information is specific to the chemical bonds and symmetry of molecules. Therefore, it provides a fingerprint by which the molecule can be identified. However, spontaneous Raman spectroscopic signal is typically very weak, and as a result the main difficulty of Raman spectroscopy is separating the weak inelastically scattered light from the intense Rayleigh scattered laser light. Then Raman spectroscopic signal in this study is further enhanced by the SPR, also known as surface enhanced Raman scattering (SERS). The increase in intensity of the Raman spectroscopic signal for adsorbates on copper surface occurs because of an enhancement in the electric field provided by the surface. This technique enables high-sensitive analysis in the near-surface region. The signature of copper-oxygen bond was measured by Raman spectroscopy for fullerenol/copper system by in-process SERS analysis. It is thought to be caused by the hydroxyls of fullerenol molecule adsorbed on the copper surface. This result suggests that fullerenol molecules absorbing onto the copper surface affect the high efficient material removal.

本文言語英語
ホスト出版物のタイトルPrecision Engineering and Nanotechnology V
出版社Trans Tech Publications Ltd
ページ332-338
ページ数7
ISBN(印刷版)9783038352112
DOI
出版ステータス出版済み - 1 1 2015
外部発表はい
イベント5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013 - Taipei, 台湾省、中華民国
継続期間: 11 12 201311 15 2013

出版物シリーズ

名前Key Engineering Materials
625
ISSN(印刷版)1013-9826
ISSN(電子版)1662-9795

その他

その他5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013
国/地域台湾省、中華民国
CityTaipei
Period11/12/1311/15/13

All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 材料力学
  • 機械工学

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