Study on innovative plasma fusion CMP and its application to processing of diamond substrate

Hideaki Nishizawa, Koki Oyama, Toshiro K. Doi, Hideo Aida, Seongwoo Kim, Yasuhisa Sano, Syuhei Kurokawa, Chengwu Wan

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

An innovative planarization system named plasma fusion CMP was developed for aiming to establish a high-efficiency/high-quality polishing process of the hard-to-process materials. In this study, we applied this system to processing of diamond substrate instead of conventional CMP (Chemical Mechanical Polishing) process. We confirmed that stable atmospheric plasma was generated in our dynamic system, and the system worked well even though CMP slurry was applied into the system. In the processing experiments of diamond substrate, plasma fusion CMP achieved 667.7 nm/hr of processing rate while conventional CMP resulted in only 1.9 nm/hr. Furthermore, plasma fusion CMP showed the superior surface roughness reduction of the substrate to CMP.

本文言語英語
ホスト出版物のタイトル2015 International Conference on Planarization/CMP Technology, ICPT 2015
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781619565104
出版ステータス出版済み - 2 17 2016
イベントInternational Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, 米国
継続期間: 9 30 201510 2 2015

出版物シリーズ

名前2015 International Conference on Planarization/CMP Technology, ICPT 2015

その他

その他International Conference on Planarization/CMP Technology, ICPT 2015
Country米国
CityChandler
Period9/30/1510/2/15

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

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