Study on the copper-chemical mechanical polishing method using water-soluble fullerenol slurry -investigation of polishing performance

Hideyuki Tachika, Yasuhiro Takaya, Terutake Hayashi, Hiroki Tanada, Ken Kokubo, Keisuke Suzuki

研究成果: ジャーナルへの寄稿記事

2 引用 (Scopus)

抄録

Chemical mechanical polishing (CMP) is a key process used for the multilayer copper interconnects. In recent years, the most common problem encountered in this regard is the inability of conventional abrasive grains to adapt to the next-generation semiconductors owing to their large particle sizes. Hence, this study proposes a water-soluble fullerenol (C6o(OH) 36) as a novel abrasive grain for Cu-CMP because of its advantageous features such as high water solubility and uniformity of particle size (1 nm); further, there is no risk of contamination of the metal when using C 6o(OH)36). In this paper, the excellent grain abrasive properties of C6o(OH)36) and its chemical affinity for copper are reported. It is experimentally confirmed that owing to its high chemical reactivity, a slurry containing C6o(OH)36) can be used to improve the rms surface roughness from 20 to 0.5 nm.

元の言語英語
ページ(範囲)489-495
ページ数7
ジャーナルSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
75
発行部数4
DOI
出版物ステータス出版済み - 1 1 2009
外部発表Yes

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Chemical mechanical polishing
Polishing
Abrasives
Copper
Particle size
Water
Chemical reactivity
Multilayers
Contamination
Solubility
Surface roughness
Semiconductor materials
Metals

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

これを引用

Study on the copper-chemical mechanical polishing method using water-soluble fullerenol slurry -investigation of polishing performance. / Tachika, Hideyuki; Takaya, Yasuhiro; Hayashi, Terutake; Tanada, Hiroki; Kokubo, Ken; Suzuki, Keisuke.

:: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, 巻 75, 番号 4, 01.01.2009, p. 489-495.

研究成果: ジャーナルへの寄稿記事

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AU - Kokubo, Ken

AU - Suzuki, Keisuke

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