Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction

K. Okazaki, Daisuke Nakamura, T. Okada, H. Niino, S. Torii, T. Makimura, K. Murakami, Akihiko Takahashi

研究成果: 著書/レポートタイプへの貢献会議での発言

抄録

We investigated a simple and productive micromachining method of silica glass by the ablation using a 10.6 μm TEA CO2 laser with a spatial resolution down to sub-wavelength scale. Copper grid mask with square apertures of 20×20 μm was attached to the silica glass surface, and the silica glass was irradiated by the TEA CO2 laser light through the mask. As a result, circular holes were formed on the silica glass surface at the center of the apertures due to the Fresnel diffraction effect, and a minimum diameter of the hole was less than 3 μm. The mechanism of the micromachining was discussed based on the electric field distribution of the CO2 laser light under the mask, by a 3D full-wave electromagnetic field simulation.

元の言語英語
ホスト出版物のタイトルTENCON 2010 - 2010 IEEE Region 10 Conference
ページ1905-1908
ページ数4
DOI
出版物ステータス出版済み - 2010
イベント2010 IEEE Region 10 Conference, TENCON 2010 - Fukuoka, 日本
継続期間: 11 21 201011 24 2010

その他

その他2010 IEEE Region 10 Conference, TENCON 2010
日本
Fukuoka
期間11/21/1011/24/10

Fingerprint

Infrared lasers
Micromachining
Fused silica
Diffraction
Irradiation
Masks
Wavelength
Lasers
Ablation
Electromagnetic fields
Electric fields
Copper

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Computer Science Applications

これを引用

Okazaki, K., Nakamura, D., Okada, T., Niino, H., Torii, S., Makimura, T., ... Takahashi, A. (2010). Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. : TENCON 2010 - 2010 IEEE Region 10 Conference (pp. 1905-1908). [5686422] https://doi.org/10.1109/TENCON.2010.5686422

Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. / Okazaki, K.; Nakamura, Daisuke; Okada, T.; Niino, H.; Torii, S.; Makimura, T.; Murakami, K.; Takahashi, Akihiko.

TENCON 2010 - 2010 IEEE Region 10 Conference. 2010. p. 1905-1908 5686422.

研究成果: 著書/レポートタイプへの貢献会議での発言

Okazaki, K, Nakamura, D, Okada, T, Niino, H, Torii, S, Makimura, T, Murakami, K & Takahashi, A 2010, Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. : TENCON 2010 - 2010 IEEE Region 10 Conference., 5686422, pp. 1905-1908, 2010 IEEE Region 10 Conference, TENCON 2010, Fukuoka, 日本, 11/21/10. https://doi.org/10.1109/TENCON.2010.5686422
Okazaki K, Nakamura D, Okada T, Niino H, Torii S, Makimura T その他. Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. : TENCON 2010 - 2010 IEEE Region 10 Conference. 2010. p. 1905-1908. 5686422 https://doi.org/10.1109/TENCON.2010.5686422
Okazaki, K. ; Nakamura, Daisuke ; Okada, T. ; Niino, H. ; Torii, S. ; Makimura, T. ; Murakami, K. ; Takahashi, Akihiko. / Sub-wavelength micromachining of silica glass by irradiation of infrared laser with Fresnel diffraction. TENCON 2010 - 2010 IEEE Region 10 Conference. 2010. pp. 1905-1908
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