Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Kazuhiro Nogita, Benjamin Kefford, Jonathan Read, Stuart D. McDonald

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

2 引用 (Scopus)

抜粋

This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.

元の言語英語
ホスト出版物のタイトルAdvanced Materials Engineering and Technology IV
編集者Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
出版者Trans Tech Publications Ltd
ページ53-57
ページ数5
ISBN(印刷物)9783035710205
DOI
出版物ステータス出版済み - 2016
イベントInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, 台湾省、中華民国
継続期間: 12 4 201512 5 2015

出版物シリーズ

名前Materials Science Forum
857
ISSN(印刷物)0255-5476
ISSN(電子版)1662-9752

その他

その他International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
台湾省、中華民国
Kaohsiung
期間12/4/1512/5/15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

フィンガープリント Suppression of Cu<sub>3</sub>Sn with Ni in high Cu containing Sn-Cu solder alloys' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Nogita, K., Kefford, B., Read, J., & McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. : M. M. Al Bakri Abdullah, R. A. Razak, M. F. M. Tahir, M. M. Al Bakri Abdullah, R. A. Razak, & L. Jamaludin (版), Advanced Materials Engineering and Technology IV (pp. 53-57). (Materials Science Forum; 巻数 857). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.857.53