Surface activated bonding of LiNbO 3 and GaN at room temperature

R. Takigawa, E. Higurashi, T. Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

3 引用 (Scopus)

抜粋

In this study, we report room-temperature wafer bonding of a GaN and a LiNbO 3 (LN) using a surface activated bonding (SAB) method. The modified SAB using Fe-containing Ar ion beam bombardment demonstrated the stronger bond strength of a GaN and a LN than the standard SAB using Ar fast atom beam bombardment. As the result of a dicing test, the bonded wafer using modified SAB method was successfully cut into 1 × 1 mm 2 dies without interfacial debonding owing to the applied stress during dicing. This result shows a strong bond strength which may be sufficient for device applications. It was found that Fe nanolayer deposited during ion beam bombardment appears to work well as an adhesive and form a strong bond between a negative surface of LN and a Ga-face of GaN.

元の言語英語
ホスト出版物のタイトルECS Transactions
編集者M. Goorsky, K.D. Hobart, F. Fournel, R. Knechtel, C.S. Tan, H. Baumgart, T. Suga
出版者Electrochemical Society Inc.
ページ207-213
ページ数7
エディション5
ISBN(電子版)9781607685395
DOI
出版物ステータス出版済み - 1 1 2018
イベントSymposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 15 - AiMES 2018, ECS and SMEQ Joint International Meeting - Cancun, メキシコ
継続期間: 9 30 201810 4 2018

出版物シリーズ

名前ECS Transactions
番号5
86
ISSN(印刷物)1938-6737
ISSN(電子版)1938-5862

その他

その他Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications 15 - AiMES 2018, ECS and SMEQ Joint International Meeting
メキシコ
Cancun
期間9/30/1810/4/18

All Science Journal Classification (ASJC) codes

  • Engineering(all)

フィンガープリント Surface activated bonding of LiNbO <sub>3</sub> and GaN at room temperature' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Takigawa, R., Higurashi, E., & Asano, T. (2018). Surface activated bonding of LiNbO 3 and GaN at room temperature : M. Goorsky, K. D. Hobart, F. Fournel, R. Knechtel, C. S. Tan, H. Baumgart, & T. Suga (版), ECS Transactions (5 版, pp. 207-213). (ECS Transactions; 巻数 86, 番号 5). Electrochemical Society Inc.. https://doi.org/10.1149/08605.0207ecst