Surface analysis of the chemical polishing process using a fullerenol slurry by Raman spectroscopy under surface plasmon excitation

Yasuhiro Takaya, Masaki Michihata, Terutake Hayashi, Ryota Murai, Kazumasa Kano

研究成果: Contribution to journalArticle査読

7 被引用数 (Scopus)

抄録

In Cu-CMP using a fullerenol slurry, effective planarization in terms of high removal rate has been confirmed. The high chemical reactivity of fullerenol is suggested to be an essential factor for copper material removal. In situ surface analysis based on the SERS method was performed to reveal the role of the copper-fullerenol interaction in the chemical reaction process during Cu-CMP. A series of SERS Raman spectra suggested that a reacted thin film formed on the copper surface, which was measured using a custom-built measurement system.

本文言語英語
ページ(範囲)571-574
ページ数4
ジャーナルCIRP Annals - Manufacturing Technology
62
1
DOI
出版ステータス出版済み - 2013
外部発表はい

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

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