A highly adherent Cu-Ni-P film was successfully grown on a UV-irradiated liquid-crystal-polymer (LCP) film. Irradiation from a UV light under an atmospheric condition created hydrophilic nanometer-scale roughness on the LCP film surface by introducing hydrophilic groups on the surface. The high adhesion strength of more than 0.8 kN/m was obtained because of the anchoring effect of the nanometer-scale roughness developed at the interface between the deposited metal and the LCP film. Copper circuit patterns formed on the LCP film showed satisfactory performance for various reliability tests. Fine circuit formation and selective plating facilitated by UV irradiation could lead to a manufacturing approach for the next generation of flexible-printed-circuit technology.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Renewable Energy, Sustainability and the Environment
- Surfaces, Coatings and Films
- Materials Chemistry