TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

研究成果: ジャーナルへの寄稿記事

7 引用 (Scopus)

抄録

The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.

元の言語英語
ページ(範囲)1550-1554
ページ数5
ジャーナルMaterials Transactions
47
発行部数6
DOI
出版物ステータス出版済み - 6 1 2006

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Energy dispersive spectroscopy
Transmission electron microscopy
transmission electron microscopy
microstructure
Microstructure
Metastable phases
Chemical analysis
Chlorides
Current density
Deposits
Metals
chlorides
deposits
current density
cross sections
Substrates
metals

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys. / Oue, Satoshi; Nakano, Hiroaki; Kuroda, Ryo; Kobayashi, Shigeo; Fukushima, Hisaaki.

:: Materials Transactions, 巻 47, 番号 6, 01.06.2006, p. 1550-1554.

研究成果: ジャーナルへの寄稿記事

Oue, Satoshi ; Nakano, Hiroaki ; Kuroda, Ryo ; Kobayashi, Shigeo ; Fukushima, Hisaaki. / TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys. :: Materials Transactions. 2006 ; 巻 47, 番号 6. pp. 1550-1554.
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abstract = "The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal{\%} of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at{\%} Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at{\%}Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.",
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N2 - The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.

AB - The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.

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