抄録
The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.
| 元の言語 | 英語 |
|---|---|
| ページ（範囲） | 1550-1554 |
| ページ数 | 5 |
| ジャーナル | Materials Transactions |
| 巻 | 47 |
| 発行部数 | 6 |
| DOI | |
| 出版物ステータス | 出版済み - 6 1 2006 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
これを引用
TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys. / Oue, Satoshi; Nakano, Hiroaki; Kuroda, Ryo; Kobayashi, Shigeo; Fukushima, Hisaaki.
：: Materials Transactions, 巻 47, 番号 6, 01.06.2006, p. 1550-1554.研究成果: ジャーナルへの寄稿 › 記事
}
TY - JOUR
T1 - TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys
AU - Oue, Satoshi
AU - Nakano, Hiroaki
AU - Kuroda, Ryo
AU - Kobayashi, Shigeo
AU - Fukushima, Hisaaki
PY - 2006/6/1
Y1 - 2006/6/1
N2 - The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.
AB - The microstructure of Ni-Sn alloys electrodeposited at 50-5000 A/m 2 from 65°C chloride solutions containing 5-40 metal% of Sn were analyzed by TEM-EDX. Ni-Sn alloy deposition showed a characteristic behavior in that Ni and Sn were codeposited at an atomic ratio of 1:1 under a wide range of solution compositions and current densities. Ni and Sn EDX mapping images of a cross section of Ni-50 at% Sn alloy deposited at over 1000 A/m 2 showed a lamellar pattern parallel to the interface between substrate and deposit, indicating the alternate deposition of Ni-Sn alloys with different compositions. The Ni-Sn alloys were identified by EDX line analysis as Ni 3Sr 4 and Ni 3Sn 2. It was concluded that Ni-50 at%Sn alloys deposited over 1000 A/m 2 were not composed of the previously reported metastable-phase NiSn single alloy, but instead consisted of both Ni 3Sn 2 and Ni 3Sn 2 alloys in a thermodynamically stable phase.
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U2 - 10.2320/matertrans.47.1550
DO - 10.2320/matertrans.47.1550
M3 - Article
VL - 47
SP - 1550
EP - 1554
JO - Materials Transactions
JF - Materials Transactions
SN - 0916-1821
IS - 6
ER -