TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys

Satoshi Oue, Hiroaki Nakano, Ryo Kuroda, Shigeo Kobayashi, Hisaaki Fukushima

    研究成果: ジャーナルへの寄稿学術誌査読

    抄録

    The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.

    本文言語英語
    ページ(範囲)804-808
    ページ数5
    ジャーナルNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
    70
    10
    DOI
    出版ステータス出版済み - 10月 1 2006

    !!!All Science Journal Classification (ASJC) codes

    • 凝縮系物理学
    • 材料力学
    • 金属および合金
    • 材料化学

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