抄録
The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.
| 元の言語 | 英語 |
|---|---|
| ページ（範囲） | 804-808 |
| ページ数 | 5 |
| ジャーナル | Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals |
| 巻 | 70 |
| 発行部数 | 10 |
| DOI | |
| 出版物ステータス | 出版済み - 10 1 2006 |
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All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Mechanics of Materials
- Metals and Alloys
- Materials Chemistry
これを引用
TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys. / Oue, Satoshi; Nakano, Hiroaki; Kuroda, Ryo; Kobayashi, Shigeo; Fukushima, Hisaaki.
：: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, 巻 70, 番号 10, 01.10.2006, p. 804-808.研究成果: ジャーナルへの寄稿 › 記事
}
TY - JOUR
T1 - TEM-EDX observations of the microstructure of electrodeposited Ni-Sn alloys
AU - Oue, Satoshi
AU - Nakano, Hiroaki
AU - Kuroda, Ryo
AU - Kobayashi, Shigeo
AU - Fukushima, Hisaaki
PY - 2006/10/1
Y1 - 2006/10/1
N2 - The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.
AB - The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.
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U2 - 10.2320/jinstmet.70.804
DO - 10.2320/jinstmet.70.804
M3 - Article
AN - SCOPUS:33845245176
VL - 70
SP - 804
EP - 808
JO - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
JF - Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
SN - 0021-4876
IS - 10
ER -