The microstructure of Ni-Sn alloys electrodeposited at 65°C and in 50-5000 A/m 2 from acidic aqueous solutions containing 1.25mol/L NiCl 2 and 0.03-0.41 mol/L SnCl 2 were examined by TEM-EDX. In the Ni-Sn alloy deposition, Ni and Sn were codeposited at an atomic ratio of 1: 1 under the wide ranges of solution compositions and current densities. EDX mapping images of a cross section of Ni-50 at%Sn alloy deposited at current densities more than 1000 A/m 2 revealed a lamellar phase parallel to the interface between substrate and deposit. The lamellar phase were identified as Ni 3Sn 4 and Ni 3Sn 2 by EDX line analysis. It was concluded that the Ni-50 at%Sn alloys were not composed of the metastable-phase NiSn single alloy reported previously, but consisted of two Ni 3Sn 4 and Ni 3Sn 4 alloy phases in a thermodynamically stable instead.
|ジャーナル||Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals|
|出版ステータス||出版済み - 10月 1 2006|
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