TEM studies on the initial stage of seeded solution growth of 6H-SiC using metal solvent

K. Kamei, K. Kusunoki, Shinji Munetoh, T. Ujihara, K. Nakajima

研究成果: ジャーナルへの寄稿記事

1 引用 (Scopus)

抄録

TEM characterization was carried out on the epitaxial interface formed by seeded solution growth of 6H-SiC using metal solvents such as Ti and Mn. The penetration of the solution into the micropipes and its solidification behavior were clearly observed. Although stacking faults are introduced in the vicinity of micropipes during the solidification, it decreases as the growth proceeds. The micropipes are terminated by the lateral overgrowth of epitaxial SiC layer. The crystallinity of 6H-SiC obtained from Si-Ti-C solution is much better than that obtained from Si-Mn-C solution.

元の言語英語
ページ(範囲)347-350
ページ数4
ジャーナルMaterials Science Forum
457-460
発行部数I
出版物ステータス出版済み - 2004
外部発表Yes

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Metals
Transmission electron microscopy
transmission electron microscopy
metals
solidification
Solidification
Epitaxial layers
Stacking faults
crystal defects
crystallinity
penetration

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

これを引用

Kamei, K., Kusunoki, K., Munetoh, S., Ujihara, T., & Nakajima, K. (2004). TEM studies on the initial stage of seeded solution growth of 6H-SiC using metal solvent. Materials Science Forum, 457-460(I), 347-350.

TEM studies on the initial stage of seeded solution growth of 6H-SiC using metal solvent. / Kamei, K.; Kusunoki, K.; Munetoh, Shinji; Ujihara, T.; Nakajima, K.

:: Materials Science Forum, 巻 457-460, 番号 I, 2004, p. 347-350.

研究成果: ジャーナルへの寄稿記事

Kamei, K, Kusunoki, K, Munetoh, S, Ujihara, T & Nakajima, K 2004, 'TEM studies on the initial stage of seeded solution growth of 6H-SiC using metal solvent', Materials Science Forum, 巻. 457-460, 番号 I, pp. 347-350.
Kamei, K. ; Kusunoki, K. ; Munetoh, Shinji ; Ujihara, T. ; Nakajima, K. / TEM studies on the initial stage of seeded solution growth of 6H-SiC using metal solvent. :: Materials Science Forum. 2004 ; 巻 457-460, 番号 I. pp. 347-350.
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