TY - JOUR
T1 - TEM study of local conduction mechanisms in model specimens of Ag-based conductive adhesive
AU - Kurosu, Keita
AU - Kawamoto, Naoyuki
AU - Murakami, Yasukazu
AU - Shindo, Daisuke
PY - 2012/2/1
Y1 - 2012/2/1
N2 - The conduction mechanisms of silver (Ag)-based conductive adhesives, which consist of metallic Ag particles and an epoxy resin, are discussed on the basis of transmission electron microscopy (TEM) studies and local conductivity measurements of model specimens. A small electrical current was observed in the model specimens, in which a thin epoxy layer was sandwiched between Ag electrodes. TEM observations demonstrated that the irreversible changes in the current versus voltage characteristics occurred along with microstructural changes in the Ag electrode, which was subjected to a large electrical current. Calculated equipotential lines indicated a considerable change in the electric field distribution near a small horn that was formed in the surface of the Ag electrode. The results provide useful information for understanding local conduction in the cured adhesive.
AB - The conduction mechanisms of silver (Ag)-based conductive adhesives, which consist of metallic Ag particles and an epoxy resin, are discussed on the basis of transmission electron microscopy (TEM) studies and local conductivity measurements of model specimens. A small electrical current was observed in the model specimens, in which a thin epoxy layer was sandwiched between Ag electrodes. TEM observations demonstrated that the irreversible changes in the current versus voltage characteristics occurred along with microstructural changes in the Ag electrode, which was subjected to a large electrical current. Calculated equipotential lines indicated a considerable change in the electric field distribution near a small horn that was formed in the surface of the Ag electrode. The results provide useful information for understanding local conduction in the cured adhesive.
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U2 - 10.1109/TCPMT.2011.2176734
DO - 10.1109/TCPMT.2011.2176734
M3 - Article
AN - SCOPUS:84859024605
VL - 2
SP - 294
EP - 299
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
SN - 2156-3950
IS - 2
M1 - 6111212
ER -