TY - JOUR
T1 - The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
AU - Zeng, Guang
AU - McDonald, Stuart D.
AU - Mu, Dekui
AU - Terada, Yasuko
AU - Yasuda, Hideyuki
AU - Gu, Qinfen
AU - Salleh, M. A.A.Mohd
AU - Nogita, Kazuhiro
N1 - Funding Information:
We gratefully acknowledge financial support from the University of Queensland -Nihon Superior collaborative research program. Synchrotron micro XRF mapping was performed at the Japan Synchrotron Radiation Research Institute (JASRI) on BL37XU of the SPring-8 synchrotron, under Proposal No. 2012B1440 and 2013B1524, partially funded by the Australian Synchrotron international synchrotron access program ( AS/IA124/6235 ). PXRD experiments were performed at the Australian Synchrotron Powder Diffraction Beamline ( AS132/PD/5784 ). This work is also supported in part by a Grant-in-Aid for Scientific Research (A) (24226018) from JSPS , Japan . The authors acknowledge the facilities, and the scientific and technical assistance, of the Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis of UQ. The authors thank Mr. Jonathan Read of the University of Queensland for valuable discussions. G. Zeng gratefully thanks for Dr. Mark D Callaghan of the University of Manchester, UK for manuscript editing. G. Zeng acknowledges the financial support of a University of Queensland International (UQI) Scholarship, a Graduate School International Travel Award (GSITA) of UQ , and the China Scholarship Council (CSC) .
Publisher Copyright:
© 2016 Elsevier B.V. All rights reserved.
PY - 2016/11/15
Y1 - 2016/11/15
N2 - Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu6Sn5 intermetallics influenced by micro-alloying in Pb-free solder joints, are of ongoing interest as this phase is crucial to the service reliability of solder joints. Our recent work has demonstrated that, after reflow, the homogeneously located micro-alloying elements of both Ni and Zn in interfacial (Cu,Ni)6(Sn,Zn)5 act to increase phase stability and prevent the undesirable polymorphic phase transformation of Cu6Sn5. This paper further investigates the influence of ageing on the phase stability of interfacial intermetallics containing Ni, Zn and Au. Phase transformations of hexagonal to monoclinic Cu6Sn5 driven by ageing, was suppressed by alloying Ni/Zn/Au, resulting in improvements in phase stability. The findings help to further understand the reliability of interfacial structures in micro-alloyed Pb-free solder joints.
AB - Formation/growth behaviour, phase stability, and mechanical properties of interfacial Cu6Sn5 intermetallics influenced by micro-alloying in Pb-free solder joints, are of ongoing interest as this phase is crucial to the service reliability of solder joints. Our recent work has demonstrated that, after reflow, the homogeneously located micro-alloying elements of both Ni and Zn in interfacial (Cu,Ni)6(Sn,Zn)5 act to increase phase stability and prevent the undesirable polymorphic phase transformation of Cu6Sn5. This paper further investigates the influence of ageing on the phase stability of interfacial intermetallics containing Ni, Zn and Au. Phase transformations of hexagonal to monoclinic Cu6Sn5 driven by ageing, was suppressed by alloying Ni/Zn/Au, resulting in improvements in phase stability. The findings help to further understand the reliability of interfacial structures in micro-alloyed Pb-free solder joints.
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U2 - 10.1016/j.jallcom.2016.05.263
DO - 10.1016/j.jallcom.2016.05.263
M3 - Article
AN - SCOPUS:84975061855
SN - 0925-8388
VL - 685
SP - 471
EP - 482
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
ER -