The Influence of Processing Conditions on the 3-D Interconnected Structure of Nanosilver Paste

Joshua A. Stuckner, Guo Quan Lu, Masatoshi Mitsuhara, William T. Reynolds, Mitsuhiro Murayama

研究成果: Contribution to journalArticle

5 引用 (Scopus)

抜粋

Nanosilver paste is a promising material for power device interconnects. Interconnects are fabricated from nanosilver paste through a sintering process that drives off solvents and dispersants and fuses the silver particles. The integrity of the resulting interconnect is affected by the silver microstructure. This paper explored how sintering temperature, atmosphere, and time influenced microstructure as revealed by transmission electron microscopy and 3-D imaging via dual-beam serial sectioning. Nanosilver paste was sintered in combinations of the following parameters: A sintering atmosphere of air or nitrogen; temperatures of 120 °C or 255 °C; and sintering times of 5, 10, or 30 min. For the 255 °C temperature, oxygen in air facilitated removal of organic solvent and dispersant molecules and led to a microstructure with a coarser ligament network than samples sintered at the same temperature and times in nitrogen. The coarser ligament network was characterized by thick connected ligaments, large connected pores, and few isolated pores; this microstructure has been correlatedwith improved mechanical strength. Details of both 2-D and 3-D ligament network morphology, grain morphology, grain size, and the associated grain boundaries are discussed.

元の言語英語
記事番号7809049
ページ(範囲)494-499
ページ数6
ジャーナルIEEE Transactions on Electron Devices
64
発行部数2
DOI
出版物ステータス出版済み - 2 2017

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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