The overview and future prospects for planarization CMP technology

研究成果: ジャーナルへの寄稿 › 総説 › 査読

1 被引用数 (Scopus)

本文言語	英語
ページ（範囲）	213-216
ページ数	4
ジャーナル	Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
巻	84
号	3
DOI	https://doi.org/10.2493/jjspe.84.213
出版ステータス	出版済み - 1月 1 2018

!!!All Science Journal Classification (ASJC) codes

@article{b344fc477b4b4ff49c7c05633536d5fa,

title = "The overview and future prospects for planarization CMP technology",

author = "Syuhei Kurokawa",

year = "2018",

month = jan,

day = "1",

doi = "10.2493/jjspe.84.213",

language = "English",

volume = "84",

pages = "213--216",

journal = "Journal of the Japan Society for Precision Engineering",

issn = "0912-0289",

publisher = "Japan Society for Precision Engineering",

number = "3",

}

TY - JOUR

T1 - The overview and future prospects for planarization CMP technology

AU - Kurokawa, Syuhei

PY - 2018/1/1

Y1 - 2018/1/1

UR - http://www.scopus.com/inward/record.url?scp=85043516367&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85043516367&partnerID=8YFLogxK

U2 - 10.2493/jjspe.84.213

DO - 10.2493/jjspe.84.213

M3 - Review article

AN - SCOPUS:85043516367

SN - 0912-0289

VL - 84

SP - 213

EP - 216

JO - Journal of the Japan Society for Precision Engineering

JF - Journal of the Japan Society for Precision Engineering

IS - 3

ER -