Thermal expansion of Cu6Sn5 and (Cu,Ni) 6Sn5

Dekui Mu, Jonathan Read, Yafeng Yang, Kazuhiro Nogita

研究成果: ジャーナルへの寄稿学術誌査読

54 被引用数 (Scopus)

抄録

Cu6Sn5 is a common intermetallic compound formed during electrical packaging. It has an allotropic transformation from the low-temperature monoclinic η′-Cu6Sn5 to high-temperature hexagonal η-Cu6Sn5 at equilibrium temperature 186 °C. In this research, the effects of this allotropic transformation and Ni addition on the thermal expansion of η′- and/or η-Cu6Sn5 were characterized using synchrotron x-ray diffraction and dilatometry. A volume expansion during the monoclinic to hexagonal transformation was found. The addition of Ni was found to decrease the undesirable thermal expansion by stabilizing the hexagonal Cu 6Sn5 at temperatures below 186 °C and reducing the overall thermal expansion of Cu6Sn5.

本文言語英語
ページ(範囲)2660-2664
ページ数5
ジャーナルJournal of Materials Research
26
20
DOI
出版ステータス出版済み - 10月 28 2011

!!!All Science Journal Classification (ASJC) codes

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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