TY - GEN
T1 - Thermal management systems for data centers with liquid cooling technique of CPU
AU - Ouchi, Mayumi
AU - Abe, Yoshiyuki
AU - Fukagaya, Masato
AU - Ohta, Haruhiko
AU - Shinmoto, Yasuhisa
AU - Sato, Masahide
AU - Iimura, Ken Ichi
PY - 2012/9/18
Y1 - 2012/9/18
N2 - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
AB - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
UR - http://www.scopus.com/inward/record.url?scp=84866167336&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866167336&partnerID=8YFLogxK
U2 - 10.1109/ITHERM.2012.6231507
DO - 10.1109/ITHERM.2012.6231507
M3 - Conference contribution
AN - SCOPUS:84866167336
SN - 9781424495320
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 790
EP - 798
BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
T2 - 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Y2 - 30 May 2012 through 1 June 2012
ER -