Thermal management systems for data centers with liquid cooling technique of CPU

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Haruhiko Ohta, Shinmoto Yasuhisa, Masahide Sato, Ken Ichi Iimura

研究成果: 著書/レポートタイプへの貢献会議での発言

8 引用 (Scopus)

抄録

Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.

元の言語英語
ホスト出版物のタイトルProceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
ページ790-798
ページ数9
DOI
出版物ステータス出版済み - 9 18 2012
イベント13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, 米国
継続期間: 5 30 20126 1 2012

出版物シリーズ

名前InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN(印刷物)1936-3958

その他

その他13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
米国
San Diego, CA
期間5/30/126/1/12

Fingerprint

Program processors
Cooling
Cooling systems
Heat exchangers
Heat pipes
Liquids
Servers
Air
Energy utilization
Chassis
Standardization
Thermal management (electronics)
Condensation
Heat transfer
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

これを引用

Ouchi, M., Abe, Y., Fukagaya, M., Ohta, H., Yasuhisa, S., Sato, M., & Iimura, K. I. (2012). Thermal management systems for data centers with liquid cooling technique of CPU. : Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 (pp. 790-798). [6231507] (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2012.6231507

Thermal management systems for data centers with liquid cooling technique of CPU. / Ouchi, Mayumi; Abe, Yoshiyuki; Fukagaya, Masato; Ohta, Haruhiko; Yasuhisa, Shinmoto; Sato, Masahide; Iimura, Ken Ichi.

Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 790-798 6231507 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

研究成果: 著書/レポートタイプへの貢献会議での発言

Ouchi, M, Abe, Y, Fukagaya, M, Ohta, H, Yasuhisa, S, Sato, M & Iimura, KI 2012, Thermal management systems for data centers with liquid cooling technique of CPU. : Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012., 6231507, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, pp. 790-798, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012, San Diego, CA, 米国, 5/30/12. https://doi.org/10.1109/ITHERM.2012.6231507
Ouchi M, Abe Y, Fukagaya M, Ohta H, Yasuhisa S, Sato M その他. Thermal management systems for data centers with liquid cooling technique of CPU. : Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 790-798. 6231507. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2012.6231507
Ouchi, Mayumi ; Abe, Yoshiyuki ; Fukagaya, Masato ; Ohta, Haruhiko ; Yasuhisa, Shinmoto ; Sato, Masahide ; Iimura, Ken Ichi. / Thermal management systems for data centers with liquid cooling technique of CPU. Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. pp. 790-798 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).
@inproceedings{622f5c3509f845f184f1ec0d22b32ee0,
title = "Thermal management systems for data centers with liquid cooling technique of CPU",
abstract = "Energy consumption in data centers has seen a drastic increase in recent years and approximately 40{\%} of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44{\%} to 53{\%} reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.",
author = "Mayumi Ouchi and Yoshiyuki Abe and Masato Fukagaya and Haruhiko Ohta and Shinmoto Yasuhisa and Masahide Sato and Iimura, {Ken Ichi}",
year = "2012",
month = "9",
day = "18",
doi = "10.1109/ITHERM.2012.6231507",
language = "English",
isbn = "9781424495320",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
pages = "790--798",
booktitle = "Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012",

}

TY - GEN

T1 - Thermal management systems for data centers with liquid cooling technique of CPU

AU - Ouchi, Mayumi

AU - Abe, Yoshiyuki

AU - Fukagaya, Masato

AU - Ohta, Haruhiko

AU - Yasuhisa, Shinmoto

AU - Sato, Masahide

AU - Iimura, Ken Ichi

PY - 2012/9/18

Y1 - 2012/9/18

N2 - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.

AB - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.

UR - http://www.scopus.com/inward/record.url?scp=84866167336&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866167336&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2012.6231507

DO - 10.1109/ITHERM.2012.6231507

M3 - Conference contribution

AN - SCOPUS:84866167336

SN - 9781424495320

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 790

EP - 798

BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012

ER -