抄録
Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
| 元の言語 | 英語 |
|---|---|
| ホスト出版物のタイトル | Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 |
| ページ | 790-798 |
| ページ数 | 9 |
| DOI | |
| 出版物ステータス | 出版済み - 9 18 2012 |
| イベント | 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 - San Diego, CA, 米国 継続期間: 5 30 2012 → 6 1 2012 |
出版物シリーズ
| 名前 | InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM |
|---|---|
| ISSN（印刷物） | 1936-3958 |
その他
| その他 | 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012 |
|---|---|
| 国 | 米国 |
| 市 | San Diego, CA |
| 期間 | 5/30/12 → 6/1/12 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
これを引用
Thermal management systems for data centers with liquid cooling technique of CPU. / Ouchi, Mayumi; Abe, Yoshiyuki; Fukagaya, Masato; Ohta, Haruhiko; Yasuhisa, Shinmoto; Sato, Masahide; Iimura, Ken Ichi.
Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012. 2012. p. 790-798 6231507 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).研究成果: 著書/レポートタイプへの貢献 › 会議での発言
}
TY - GEN
T1 - Thermal management systems for data centers with liquid cooling technique of CPU
AU - Ouchi, Mayumi
AU - Abe, Yoshiyuki
AU - Fukagaya, Masato
AU - Ohta, Haruhiko
AU - Yasuhisa, Shinmoto
AU - Sato, Masahide
AU - Iimura, Ken Ichi
PY - 2012/9/18
Y1 - 2012/9/18
N2 - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
AB - Energy consumption in data centers has seen a drastic increase in recent years and approximately 40% of it is spent on cooling facilities. In data centers, server racks are cooled down indirectly by chilled air with an air conditioner. This technique is inefficient because IT equipment is not cool enough whereas the server room is overcooled. Under these circumstances, the authors have proposed liquid cooling systems in which CPUs are cooled down directly and exhaust heat is not radiated into the server room. Three cooling technique for CPUs are developed simultaneously. Two of them involve a single-phase heat exchanger and a two-phase heat exchanger as a cooling jacket. The other is flat heat pipes in order that the heat generated by CPU is cooled after being transported to the outside of the chassis. Condensation section of the heat pipe is cooled down by liquid with liquid manifold, so that there is no air cooling part in our new liquid cooling systems. Performance evaluation tests of the cooling devices have been conducted, which are single-phase heat exchanger, two-phase heat exchanger and two-types of flat heat pipes. Meanwhile, nanofluid technology for heat transfer enhancement and development of plug-in connectors for standardization of the systems are pursued. In addition, Verification tests have been carried out with using commercial servers. As a result, a 44% to 53% reduction in energy consumption of cooling facilities with single-phase cooling system was realized compared with conventional air cooling system.
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U2 - 10.1109/ITHERM.2012.6231507
DO - 10.1109/ITHERM.2012.6231507
M3 - Conference contribution
AN - SCOPUS:84866167336
SN - 9781424495320
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 790
EP - 798
BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
ER -