Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature-entropy analysis

A. Chakraborty, B. B. Saha, S. Koyama, K. C. Ng

研究成果: Contribution to journalArticle

58 引用 (Scopus)

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This article presents the temperature-entropy analysis, where the Thomson effect bridges the Joule heat and the Fourier heat across the thermoelectric elements of a thermoelectric cooling cycle to describe the principal energy flows and performance bottlenecks or dissipations. Starting from the principles of thermodynamics of thermoelectricity, differential governing equations describing the energy and entropy flows of the thermoelectric element are discussed. The temperature-entropy (T-S) profile in a single Peltier element is pictured for temperature dependent Seebeck coefficient and illustrated with data from commercial available thermoelectric cooler.

元の言語英語
ページ(範囲)3547-3554
ページ数8
ジャーナルInternational Journal of Heat and Mass Transfer
49
発行部数19-20
DOI
出版物ステータス出版済み - 9 2006

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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