Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature

Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, Tanemasa Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抜粋

Impact of bonding temperature on bonding dynamics in the ultrasonic bonding of Cu FAB (free air ball) is investigated by measuring dynamic strain with piezoresistive strain sensor. The strain sensor was composed of an array of pairs of n-and p-type strain gauges to determine the strains along two axes, the axis of ultrasonic motion and the axis perpendicular to the surface of the substrate. Au wire bonding was also investigated for comparison. The substrate temperature was changed from room temperature to 150°C. It is clearly observed that deformation of FAB is accelerated by elevating the substrate temperature. Most of the deformation of FAB is found to be completed within several milliseconds after the start of the bonding operation. For the case of Au FAB bonding, significant reduction of residual strain was observed at 150°C.

元の言語英語
ホスト出版物のタイトルEMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
編集者Andrzej Dziedzic, Piotr Jasinski
出版者Institute of Electrical and Electronics Engineers Inc.
ページ1-5
ページ数5
ISBN(電子版)9780956808646
DOI
出版物ステータス出版済み - 4 24 2018
イベント21st European Microelectronics and Packaging Conference and Exhibition, EMPC 2017 - Warsaw, ポーランド
継続期間: 9 10 20179 13 2017

出版物シリーズ

名前EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
2018-January

その他

その他21st European Microelectronics and Packaging Conference and Exhibition, EMPC 2017
ポーランド
Warsaw
期間9/10/179/13/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films

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  • これを引用

    Sakamoto, M., Nakadozono, K., Iwanabe, K., & Asano, T. (2018). Time evolution of strain distribution during ultrasonic bonding of Cu wire: Impact of bonding temperature. : A. Dziedzic, & P. Jasinski (版), EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition (pp. 1-5). (EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition; 巻数 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/EMPC.2017.8346852