Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C

Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, Tanemasa Asano

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抜粋

Bonding dynamics during ultrasonic bonding of Cu free air ball (FAB) is investigated by measuring dynamic strain with piezoresistive strain sensor. Change in dynamic strain with elevating substrate temperature up to 200°C was investigated. It was clearly observed that elevating substrate temperature significantly enhanced deformation of the Cu FAB while the application of pressing load and ultrasonic vibration. Visualization of the average strain clearly indicated that concentration of strain in the device layer at the positon over which the end of capillary was present was reduced. Therefore, elevating substrate temperature may reduce generation of damage in the device layer. It was also found that elevating substrate temperature reduced the residual strain in the device layer.

元の言語英語
ホスト出版物のタイトル2017 IEEE CPMT Symposium Japan, ICSJ 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ149-152
ページ数4
ISBN(電子版)9781538627129
DOI
出版物ステータス出版済み - 12 26 2017
イベント2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, 日本
継続期間: 11 20 201711 22 2017

出版物シリーズ

名前2017 IEEE CPMT Symposium Japan, ICSJ 2017
2017-January

その他

その他2017 IEEE CPMT Symposium Japan, ICSJ 2017
日本
Kyoto
期間11/20/1711/22/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • これを引用

    Sakamoto, M., Nakadozono, K., Iwanabe, K., & Asano, T. (2017). Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200°C. : 2017 IEEE CPMT Symposium Japan, ICSJ 2017 (pp. 149-152). (2017 IEEE CPMT Symposium Japan, ICSJ 2017; 巻数 2017-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2017.8240137