Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair

Anutosh Chakraborty, Bidyut Baran Saha, Kim Choon Ng, Jingming He, Ibrahim Ibrahim El-Sharkawy, Shigeru Koyama

    研究成果: 著書/レポートタイプへの貢献会議での発言

    抄録

    This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.

    元の言語英語
    ホスト出版物のタイトル4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
    出版者National Taipei University of Technology
    ページ293-298
    ページ数6
    ISBN(印刷物)9868509610, 9789868509610
    出版物ステータス出版済み - 1 1 2009
    イベント4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 - Taipei, 台湾省、中華民国
    継続期間: 5 20 20095 22 2009

    出版物シリーズ

    名前4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009

    その他

    その他4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009
    台湾省、中華民国
    Taipei
    期間5/20/095/22/09

    Fingerprint

    Silica Gel
    Silica gel
    Transient analysis
    Copper
    Cooling
    Adsorption
    Water
    Adsorption isotherms
    Electronic cooling
    Temperature
    Kinetics
    Waste heat
    Heat sinks
    Adsorbates
    Microelectronics
    Adsorbents
    Sorption
    Computer simulation

    All Science Journal Classification (ASJC) codes

    • Chemical Engineering (miscellaneous)

    これを引用

    Chakraborty, A., Saha, B. B., Ng, K. C., He, J., El-Sharkawy, I. I., & Koyama, S. (2009). Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. : 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 (pp. 293-298). (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009). National Taipei University of Technology.

    Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. / Chakraborty, Anutosh; Saha, Bidyut Baran; Ng, Kim Choon; He, Jingming; El-Sharkawy, Ibrahim Ibrahim; Koyama, Shigeru.

    4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology, 2009. p. 293-298 (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).

    研究成果: 著書/レポートタイプへの貢献会議での発言

    Chakraborty, A, Saha, BB, Ng, KC, He, J, El-Sharkawy, II & Koyama, S 2009, Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. : 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009, National Taipei University of Technology, pp. 293-298, 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009, Taipei, 台湾省、中華民国, 5/20/09.
    Chakraborty A, Saha BB, Ng KC, He J, El-Sharkawy II, Koyama S. Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. : 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology. 2009. p. 293-298. (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).
    Chakraborty, Anutosh ; Saha, Bidyut Baran ; Ng, Kim Choon ; He, Jingming ; El-Sharkawy, Ibrahim Ibrahim ; Koyama, Shigeru. / Transient analysis of an advanced adsorption cooling device employing copper-sputtered silica-gel and water pair. 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009. National Taipei University of Technology, 2009. pp. 293-298 (4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009).
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    abstract = "This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.",
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    AU - He, Jingming

    AU - El-Sharkawy, Ibrahim Ibrahim

    AU - Koyama, Shigeru

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