Trend in thermal resistance of advanced power modules

Nobuyuki Shishido, Masanori Tsukuda, Shin Ichi Nishizawa

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抜粋

Thermal management is essential to reliable design of power modules. In this report, a trend in the thermal resistance of power modules was examined by reviewing the current cooling technologies. The thermal resistance of power modules has decreased to approximately 1/3x in 10 years. Our numerical simulation about cooling suggests that a straightforward development in liquid cooling technology can achieve the update corresponds to the expected change in next 5 year when it keeps this trend in next decades. However, further progress in thermal resistance shall require higher thermal-conductive materials for spreader and two-phase cooling technologies.

元の言語英語
ホスト出版物のタイトルPCIM Europe-International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019
編集者Martina Amrhein, Anna Schulze Niehoff
出版者Mesago PCIM GmbH
ページ104-108
ページ数5
ISBN(印刷物)9783800749386
出版物ステータス出版済み - 1 1 2019
イベントInternational Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019 - Nuremberg, ドイツ
継続期間: 5 7 20195 9 2019

出版物シリーズ

名前PCIM Europe Conference Proceedings
ISSN(電子版)2191-3358

会議

会議International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019
ドイツ
Nuremberg
期間5/7/195/9/19

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • これを引用

    Shishido, N., Tsukuda, M., & Nishizawa, S. I. (2019). Trend in thermal resistance of advanced power modules. : M. Amrhein, & A. Schulze Niehoff (版), PCIM Europe-International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2019 (pp. 104-108). (PCIM Europe Conference Proceedings). Mesago PCIM GmbH.