Ultramicrotomy of wire-bonded interfaces for TEM observation

Yoshiko Itoh, Hiroshi Haji, Hideharu Nakashima, Haruo Kishida

研究成果: ジャーナルへの寄稿コメント/討論

2 引用 (Scopus)

抜粋

To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.

元の言語英語
ページ(範囲)151-153
ページ数3
ジャーナルJournal of Electron Microscopy
44
発行部数3
出版物ステータス出版済み - 6 1 1995

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Instrumentation

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