抄録
To develop a technique for TEM examination of wire-bonded interfaces, which is important to solve problems in the IC industry, thin films with intermetallic interfaces were prepared by an ultramicrotome technique. There is no amorphous phase in these films, whereas in the films prepared by ion milling, the interface has become amorphous. From this result, a suitable TEM microscopic technique to prepare films of wire-bonded interface is discussed.
| 本文言語 | 英語 |
|---|---|
| ページ（範囲） | 151-153 |
| ページ数 | 3 |
| ジャーナル | Journal of Electron Microscopy |
| 巻 | 44 |
| 号 | 3 |
| 出版ステータス | 出版済み - 6月 1995 |
!!!All Science Journal Classification (ASJC) codes
- 器械工学