Paying attention to high pressure micro jet (HPMJ) as a method of non-destructive conditioning in CMP for silicon wafers, we have executed experiments of CMP for silicon wafers using 2 types of textile pads and their conditioning. 2 types means unwoven cloth type now being widely used for silicon CMP and micro fiber cloth type being expected as the pad for next generation. There are problems in CMP using textile pads, at their conditioning; i.e., diamond dressing causes shorter pad life and brushing gives insufficient effect. After surveying relation between the conditioning by HPMJ and pad types as well as CMP characteristics by each type of pads through the experiments, it is found that the HPMJ conditioning gives both types of pad an improved removal rates. It is also found, however that such effectiveness varies by type of the pad, especially by its hardness. As the conditioning by HPMJ is non-destructive, it gives effect of longer pad life in CMP of silicon wafers by textile pads and may be expected as the effective conditioning method.
|ジャーナル||Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering|
|出版ステータス||出版済み - 9月 2010|
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