Verification of generation and removal process of surface brittle film, in polishing process using water soluble fullerenol

Kazumasa Kano, Terutake Hayashi, Yasuhiro Takaya, Ken Kokubo

研究成果: Chapter in Book/Report/Conference proceedingConference contribution

抄録

Semiconductor devices have multilayer interconnection to achieve high density circuit. In the fabrication process, due to necessity of the flatness and the smoothness of each layer, CMP is widely used. However in the conventional copper-CMP process, the abrasive grain for the slurry has a problem to apply to the next design rule, due to their large particle sizes. Thus, water soluble fullerenol, C60(OH)36 whose particle size is quite small (<1 nm), and has high quality planarization efficiency, is proposed as the abrasive grain for copper-CMP. In this study, to determine the mechanism of the copper-CMP process using water soluble fullerenol, the generation of oxidized film is investigated, and on the surface of wafer, generation of a large amount of porous film is confirmed. Furthermore, in the case with and without C60(OH)36, the different materials appeared on the film. Therefore, it is considered that C60(OH) 36 has chemical effect that alters surface condition in this process.

本文言語英語
ホスト出版物のタイトル10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010
ページ555-558
ページ数4
出版ステータス出版済み - 2010
外部発表はい
イベント10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010 - Osaka, 日本
継続期間: 9 5 20109 9 2010

出版物シリーズ

名前10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010

その他

その他10th International Symposium on Measurement and Quality Control 2010, ISMQC 2010
Country日本
CityOsaka
Period9/5/109/9/10

All Science Journal Classification (ASJC) codes

  • Safety, Risk, Reliability and Quality

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