Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Young Bae Kim, Hiroshi Noguchi, Masazumi Amagai

研究成果: ジャーナルへの寄稿Conference article

25 引用 (Scopus)

抜粋

The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.

元の言語英語
ページ(範囲)891-897
ページ数7
ジャーナルProceedings - Electronic Components and Technology Conference
出版物ステータス出版済み - 7 17 2003
イベント53rd Electronic Components and Technology Conference 2003 - New Orleans LA, 米国
継続期間: 5 27 20035 30 2003

    フィンガープリント

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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