The high cycle vibration fatigue life characteristics of Pb-free and Pb packages were studied under various mixed mode stress by a new test method and FEM. It was found that the effect of frequency on a high cycles vibration fatigue life of Pb-free and Pb package can be ignored within a range of 10∼25Hz. Using a normal shear stress, the evaluation of Pb-free and Pb package fatigue life was possible without considering a mixed mode stress. The vibration fatigue induced a crack in a solder ball itself.
|ジャーナル||Proceedings - Electronic Components and Technology Conference|
|出版物ステータス||出版済み - 7 17 2003|
|イベント||53rd Electronic Components and Technology Conference 2003 - New Orleans LA, 米国|
継続期間: 5 27 2003 → 5 30 2003
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering